SMT-University-da qabr toshqini oldini olish mumkin
Causes : Uneven pad heating (ΔT >5°C between pads). Incorrect stencil design (asymmetrical solder volume). Excessive placement offset (>30% yadro kengligi) . . kattaroq post o'lchamiga etmallik, kattaroq padarning tezligini 1: 1. 5 ga teng yoki teng. OfLow ...
Mahsulotni tanishtirish
Sabablar:
Uneven pad heating (ΔT >Proklar orasidagi 5 daraja) .
Noto'g'ri Stencil dizayni (asymmetrik loguction) .
Excessive placement offset (>30% pad kengligi) .
Echimlar:
Pad dizayni:
Kattaroq postda termal yordamni ko'paytiring .
Pad o'lchami nisbati 1: 1. 5 ga teng qismlar uchun 5 ga teng.
O'lno faktor:
Nishab<1.5°C/sec to balance temperature.
Vaqt 60-90 darajani .
Jarayonni boshqarish:
Paste burilishi . pasta chizig'ini tekshirish uchun 3D SPI-dan foydalaning
Issiq teglar: SMT yig'ish, Xitoy, ishlab chiqaruvchilar, zavod, arzon, arzon, arzon, narxlar, arzon narxlar, sotib olishda maqbashni oldini olish mumkin
Sizga ham yoqishi mumkin
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